Perspective
Working notes
White papers and working notes on how value moves through the AI infrastructure stack. Read on the site, or download to share. Each one ends with the strongest argument against itself.
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The binding constraint moves every fifteen years, and margin follows it
Whoever solves the scarce resource holds the pricing power. The scarce resource keeps changing, and commercial organizations are slow to follow it.
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The reference design is the first gate now, not the OEM
Component sellers still organize around server OEMs, because that is where the purchase order comes from. The decision moved upstream and most commercial teams have not followed it.
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The barbell
Value is accruing to vertically integrated players and to open-standard specialists. Everything in between is getting compressed, and it is remarkably easy to end up there by accident.
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Thermal’s next problem is uniformity, not capacity
Almost all thermal marketing is a capacity argument. As packages become mixed assemblies of logic, memory and optics, the binding requirement becomes the spread rather than the total.
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A part loses to a method
The dangerous competitor to a hardware component is rarely a better component. It is a competitor whose approach lives inside the customer’s design flow.
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Shared commitment beats free engineering
Long design-in programs fail for a reason that never appears in a forecast: neither side is committed, and both sides call the program active.
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A booth makes you a vendor; a podium makes you a source
Technical conferences are the highest-leverage access instrument available at the architecture layer, and the dates that govern your access are the abstract deadlines, not the show dates.